| 1 | Design-for-manufacturing review | Reviews the PCB layout, component library, polarity, package clearances, panelization, and assembly drawings before production. | Gerber or ODB++ data review, bill-of-material checks, stencil and panel design tools. | Resolved engineering questions, approved manufacturing data, and documented assembly instructions. |
| 2 | Material verification and preparation | Checks incoming PCBs and components against the bill of materials, manages lot traceability, and handles moisture-sensitive parts according to their requirements. | Receiving inspection, barcode tracking, dry cabinets, and controlled component storage. | Verified materials with traceable lot or date-code records; damaged or mismatched items are held for review. |
| 3 | Solder-paste printing | Applies solder paste through a stencil onto the PCB pads in the locations needed for surface-mount components. | Stencil printer, solder paste, stencil, and print setup controls such as alignment and squeegee parameters. | Paste deposits are checked for position, coverage, and volume, commonly using solder-paste inspection (SPI). |
| 4 | Component placement | Places surface-mount components onto the printed solder-paste deposits using programmed placement data. | Pick-and-place machines, feeders, vision systems, and verified component-orientation data. | Components are placed at the programmed locations and orientations; placement results can be reviewed by machine data and downstream inspection. |
| 5 | Reflow soldering | Heats the populated board using a controlled profile so the solder paste melts, forms joints, and cools. | Conveyor reflow oven with multiple heating zones; profile settings are selected for the solder alloy, PCB, and component limits. | Thermal profiling verifies that the board follows the required temperature profile. Lead-free SAC alloys commonly have peak temperatures around 235–250°C, subject to the solder-paste and component specifications. |
| 6 | Automated optical inspection | Inspects visible solder joints and component placement for defects such as missing, shifted, reversed, or incorrectly soldered parts. | 2D or 3D automated optical inspection (AOI) systems with product-specific inspection programs. | Suspect results are reviewed and classified; AOI does not directly inspect solder joints hidden beneath packages. |
| 7 | Hidden-joint inspection | Uses additional inspection where package construction or product risk makes hidden solder joints difficult to assess optically. | X-ray inspection, commonly used for packages such as ball grid arrays (BGAs) and some bottom-termination components. | Review of hidden-joint characteristics, such as bridging or voiding, against the applicable product acceptance criteria. |
| 8 | Through-hole and selective soldering | Fits and solders through-hole components when the design includes them, often after SMT reflow. | Manual soldering, wave soldering, or selective soldering equipment, chosen according to board design and production needs. | Inspection confirms component orientation, solder coverage, and compliance with the specified workmanship criteria. |
| 9 | Electrical and functional testing | Checks assembled boards for electrical opens or shorts and, when required, verifies operation against the product specification. | In-circuit test (ICT), flying-probe test, boundary-scan test, or a product-specific functional test fixture. | Recorded pass/fail results and repair or failure analysis for boards that do not meet test requirements. |
| 10 | Rework, final inspection, and shipment | Repairs approved defects, performs final checks, protects the assemblies for transport, and prepares production records. | ESD-controlled workstations, suitable rework tools, visual inspection, packaging, and traceability systems. | Assemblies are released according to the agreed acceptance criteria, with applicable inspection, test, and traceability records. |