| Cathodic arc evaporation | An electric arc vaporizes material from a solid cathode. The ionized coating material is directed toward prepared substrates. | Hard nitride and carbon-based coatings for cutting tools, dies, and wear-resistant components. | High ionization and strong coating adhesion; well established for hard, wear-resistant coatings. | Droplets or macroparticles can form on the coating surface. Filtering and process design may reduce them, but can affect deposition rate or system complexity. | Tooling and parts where coating hardness and wear resistance are priorities. |
| DC magnetron sputtering | A plasma bombards a target, ejecting atoms that travel through the vacuum chamber and deposit on substrates. Magnetic fields help sustain the plasma. | Metal and compound films for optical, decorative, electronic, and functional applications; DC is generally used with electrically conductive targets. | Good film uniformity and control; suitable for a broad range of target materials and coating designs. | Reactive processes can require careful control of gas flow and target condition. Electrically insulating targets generally call for RF or another suitable power method rather than DC. | Applications needing controlled, uniform films and flexibility in coating materials. |
| RF magnetron sputtering | Radio-frequency power sustains sputtering and helps prevent charge build-up on electrically insulating targets. | Oxides, nitrides, and other insulating or dielectric films used in optical, electronic, and research applications. | Can deposit materials that are difficult to sputter using a conventional DC supply. | Power supplies and process matching are more involved than for basic DC sputtering; deposition conditions depend on the target and film requirements. | Insulating target materials and applications requiring dielectric or compound films. |
| HiPIMS (High Power Impulse Magnetron Sputtering) | Short, high-power pulses are applied to a magnetron target, producing a highly ionized sputtered flux. | Dense metallic and compound coatings for demanding wear, corrosion, and functional applications. | High ionization can support dense films and improved control of ion bombardment at the substrate. | Requires specialized pulsed-power equipment and process development. Average deposition rate may be lower than conventional magnetron sputtering in some process configurations. | High-performance films where film density and ionized deposition are more important than simple process setup. |
| Electron-beam evaporation | An electron beam heats material in a source crucible or hearth until it evaporates and condenses on substrates. | Optical and electronic films, including metals and selected oxides, depending on source and process design. | Can evaporate many high-melting-point materials and allows separate sources for multilayer coating designs. | The vapor is generally line-of-sight, so fixture design and substrate movement affect coverage. Film density and adhesion may require careful substrate preparation or ion assistance. | Optical and thin-film work requiring precise material layers or evaporation of refractory materials. |
| Ion-beam-assisted deposition (IBAD) | A deposition source forms the film while a separate ion beam simultaneously or sequentially bombards the growing layer. | Optical, protective, and specialized functional films where film structure or adhesion needs additional control. | Provides an independent means of influencing film growth through ion energy and bombardment conditions. | Adds equipment and process complexity. Suitable beam conditions depend on the coating material, substrate, and desired film properties. | Specialized coating processes that need separate control of deposition and ion bombardment. |
| Inline or continuous magnetron sputtering | Substrates move through connected vacuum zones while one or more sputtering sources deposit the film. | Large-area glass, sheet, web, and high-volume production of optical, architectural, and functional coatings. | Supports repeatable, high-throughput production and multilayer processes across large substrate areas. | Requires substantial floor space, vacuum infrastructure, and production planning. System configuration must match substrate dimensions and throughput needs. | Large-area or high-volume manufacturing where continuous processing is practical. |